Lift and rotate assembly for use in a workpiece processing station and a method of attaching the same

ABSTRACT

A lift and rotate assembly for use in a workpiece processing station. The lift and rotate assembly includes a body having a slim profile and pins located on opposite sides for mounting the assembly onto a tool frame. The lift and rotating assembly further includes a rotating mechanism coupling a processing head to the body, and for rotating the process head with respect to the body. The rotating mechanism includes a motor, wherein the motor is located within the processing head and the shaft of the motor is coupled to and rotationally fixed with respect to the body. The lift and rotate assembly further includes a lift mechanism for lifting the process head with respect to the body. A cable assembly within the lift and rotate assembly includes a common cable loop for feeding additional length of cable along both the lift direction and the rotational direction of movement.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional application of U.S. patent application Ser. No.09/351,980, filed Jul. 12, 1999, entitled LIFT AND ROTATE ASSEMBLY FORUSE IN A WORKPIECE PROCESSING STATION AND A METHOD OF ATTACHING THE SAMEnow U.S. Pat. No. 6,168,695.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable

BACKGROUND OF THE INVENTION

The present invention is directed to an apparatus for processing ofsemiconductor wafers, and in particular, a lift and rotate assembly foruse in a workpiece processing station.

During the manufacture of semiconductor integrated circuits and othersemiconductor articles from semiconductor wafers, it is often necessaryto perform several processing steps in one or more processing stations.In order to more fully automate the process and minimize operatorhandling, tool architectures have been developed incorporating multipleprocessing stations and automated means for moving semiconductor wafersfrom one processing station to the next.

When developing a tool architecture one consideration is the overallsize of a tool. One reason for this is because the manufacture ofsemiconductor integrated circuits typically take place in a clean roomenvironment, where the creation and maintenance of clean room space hasa relatively higher cost, which is related to the size of the space. Asa result, efforts and developments which reduce the overall tool sizecan have a significant cost benefit.

Tool seize can often be an important consideration when adding to and/orupdating a particular tool in a line. If the size and shape of the newtool is equal to or smaller than the available space or the spacecreated by the removal of the old tool being replaced, the impact onnearby tools is minimized. In contrast, when a new or replacement toolis larger than the available space or the space required by the previoustool, it can potentially require the adjustment and/or relocation of theplacement of nearby tools.

One reason to update one or more tools in a semiconductor manufacturingline is to make a transition from a smaller to a larger wafer size. Theuse of larger wafer sizes is desirable because it enables a greaternumber of devices to be manufactured on each wafer. By producing moredevices on each wafer the cost of manufacturing each device can often bereduced.

Whereas the present standard wafer size for a majority of semiconductormanufacturing lines is 200 millimeters there is an increasing trendtoward the use of 300 millimeter wafers. Therefore, efforts atminimizing or maintaining tool size, while enabling the tool to handlelarger wafer sizes would similarly be beneficial.

Another consideration when developing a tool architecture is ease ofmaintenance. Occasionally individual processing stations or portionsthereof, need to be removed for regular cleaning and/or maintenance, orreplacement. The easier it is to service the assembly or subassemblyrequiring maintenance, the less time a tool will be down or out ofservice.

Ease of maintenance becomes especially important when one considersthat, as previously noted, semiconductor manufacturing tools are oftenlocated in a clean room environment. In clean room environments,personnel are typically required to wear protective clothing includinggloves, coats, masks, etc., which can make even routine tasks morecumbersome. Therefore, improvements in accessibility of installedassemblies and/or subassemblies and the ease of installation and/orremoval of the same would similarly be beneficial.

BRIEF SUMMARY OF THE INVENTION

A lift and rotate assembly for use in a workpiece processing station isprovided. The lift and rotate assembly comprises a body and a processhead for receiving a workpiece. The process head is coupled to the bodyby a rotating mechanism enabling the process head to rotate with respectto the body.

In at least one embodiment, the rotating mechanism includes a motor,wherein the motor is located within the process head. The shaft of themotor is coupled to and rotationally fixed with respect to the body.

In at least an other embodiment, the lift and rotate assembly furtherincludes a lift mechanism for lifting the portion of the body coupled tothe process head with respect to the other portion of the body, inaddition to the rotating mechanism.

The lift and rotate assembly further provides for a cable assemblyproviding at least one of signals, gases, and fluids to the processinghead. The cable assembly includes a common cable loop for feedingadditional length of cable along both the lift direction of movement bythe lift mechanism and the rotational direction of movement by therotating mechanism.

In a further embodiment, the lift and rotate assembly provides for pinsadapted for mounting the assembly to an exposed surface of a tool frame.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 illustrates a top plan view of a prior art processing tool.

FIG. 2 illustrates an isometric view of a partial processing tool inaccordance with the present invention shown with several panels removed.

FIG. 3 illustrates an isometric front view of the lift and rotateassembly in accordance with the present invention, showing the processhead lifted vertically into a raised position with the process headrotated up into a load position.

FIG. 4 illustrates an isometric back view of the lift and rotateassembly illustrated in FIG. 3.

FIG. 5 illustrates an isometric front view of the lift and rotateassembly in accordance with the present invention, showing the processhead lowered vertically into a lowered position with the process headrotated down into a processing position.

FIG. 6 illustrates an isometric back view of the lift and rotateassembly illustrated in FIG. 5.

FIG. 7 illustrates an isometric view of the lift and rotate assemblymounted to an exposed surface of a processing tool with the side panelremoved.

FIG. 8 illustrates an isometric view of the socket, saddle, andadjustable surfaces, coupled to an exposed surface of the processingtool, within and against which the pins of the lift and rotate assemblyrest.

FIG. 9 illustrates the lift and rotate assembly of FIG. 4 with the backcovers removed.

FIG. 10 illustrates the lift and rotate assembly of FIG. 6 with the backcovers removed.

FIG. 11 illustrates a side cross sectional view of the lift and rotateassembly rotated down in the processing position.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 illustrates a top plan view of one example of a prior artprocessing tool 10. Specifically, FIG. 1 illustrates a top plan view ofthe top deck 15 of an LT-210™ processing tool manufactured by SemitooLInc. The LT-210™ processing tool is a tool architecture designed forprocessing semiconductor wafers up to 200 millimeters in size. The deck15 includes openings 20 and 25 within which individual processingstations or components thereof can be received. Openings 20 correspondto openings within which processing chambers/bowls are typicallyreceived. Openings 25 correspond to openings within which correspondinglift and rotate mechanisms are typically received. To install acorresponding lift and rotate assembly, the assembly is raised above theopening and a portion of the assembly is inserted into the opening 25.

FIG. 2 illustrates an isometric view of a partial processing tool 100,in accordance with the present invention. Several of the panels areshown removed, however, a pair of side panels 105 are shown still inplace. FIG. 2 further shows several lift and rotate assemblies 200,which are installed in the partial processing tool 100. Some of the liftand rotate assemblies 200 are shown without their corresponding processheads 205. Similar to the processing tool 10 in FIG. 1, the processingtool 100 includes a deck 110 having openings 115 within which processingchambers/bowls 400 (FIG. 7) are typically received.

Whereas the lift and rotate assemblies of the prior art processing tool10 (FIG. 1) have openings 25 in the deck 15 within which the lift andtilt assemblies are received, the preferred embodiment of the presentinvention includes lift and rotate assemblies 200, which attach at theback edge 120 of the deck 110. This enables more room on the deck foraccommodating a larger processing chamber/bowl which is capable ofhandling larger wafer sizes.

The lift and rotate assemblies 200 can be used in conjunction with theprocessing chambers/bowls 400 to provide for processes including platingprocesses, rinse/dry processes, electroless plating processes, and/orimmersion chamber processes.

FIGS. 3 and 4 illustrate an isometric view of each of the front and backview of the lift and rotate assembly 200. The lift and rotate assemblyincludes a process head 205 and a base 210. The process head 205 isrotatably coupled to the base by a rotating mechanism more clearly shownin connection with FIG. 11. The base 210 includes a first portion 215and a second portion 220. The second portion 220 is adapted so as to becapable of being lifted with respect to the first portion 215.Specifically, the process head 205 is coupled to the second portion 220of the base 210, so as to move with the second portion 220 as it moveswith respect to the first portion 215.

In the preferred embodiment, the process head 205 is shown with a singlering contact 225, against which a wafer to be processed after beingreceived will be held in place. In at least one preferred embodiment,the ring contact provides power to the wafer.

At the side near the bottom of the base 210 is a connection box 230through which signals, including both communication and power signals,gases, and fluids can be received. In the preferred embodiment, theconnection box 230 includes three terminals 235, 240 and 245. Terminal235 receives electronic signals. Terminal 240 receives plating power.Terminal 245 receives gases for actuating the pneumatics and for abackside nitrogen (N₂) purge.

The base 210 further includes a pair of pins 250 (one not shown) on eachside of the base 210. The pins 250 are adapted for mounting the lift androtate assembly to the workpiece processing tool frame 100, shown inFIG. 2.

FIGS. 5 and 6 illustrate an isometric view of each of the front and backview of the lift and rotate assembly 200 in accordance with the presentinvention, showing the process head 205 lowered vertically into alowered position with the process head 205 rotated down into aprocessing position. Otherwise, the features are very similar to theones shown in FIGS. 3 and 4.

FIG. 7 illustrates an isometric view of the lift and rotate assembly 200mounted to an exposed surface 125 of a processing tool 100 with the sidepanel 105, shown in FIG. 2, removed. On the exposed surface 125 of theprocessing tool 100 is a socket 130, a saddle 135, and a pair ofadjustable surfaces 140. A pair of clips 145 captivates the two top pins250 with respect to each of the adjustable surfaces 140. It is notedthat the clips can take on a variety of forms. A couple of examplesinclude a screw on clamp or a self retaining spring clip.

Processing chambers/bowls 400 are shown extending from openings withinthe deck 110.

FIG. 8 illustrates an isometric view of the socket 130, saddle 135, andadjustable surfaces 140, coupled to an exposed surface 125 of theprocessing tool 100, within and against which the pins 250 of the liftand rotate assembly 200 are adapted to rest.

The socket 130 includes a spherical recess 150 for receiving a pin 250,and has a jack screw 160, which enables the socket 130 to be adjusted ina direction shown by the arrow labeled X. The saddle 135 includes acylindrical groove 155 for receiving a pin 250, and similarly has a jackscrew 165, which enables the saddle 135 to be adjusted in a directionshown by the arrow labeled Z. A pair of jack screws 170 enables theadjustable surfaces 140 to be adjusted in a direction shown by thearrows labeled Y.

Initially, when the lift and rotate assembly 200 is being installed, thelower left pin 250 is placed in the spherical groove 150 of the socket130. With the lower left pin in place, the lower right pin 250 is thenlifted up and over the lip 175 of the saddle 135 and lowered into thecylindrical groove 155.

Aided by the weight of the process head 205, the center of gravitycauses the remaining two upper pins 250 of the lift and rotate assembly200 to fall in the direction of the process head 205 until it comes intocontact with the adjustable surfaces 140. In order to provide greaterstability, the upper pins 250 of the lift and rotate assembly 200 arecaptivated against the adjustable surfaces 140. A pair of clips 145 areattached to the adjustable surfaces 140 in holes 180 located at the topof the adjustable surface. When in place, the clips 145 extend over andaround the upper pins 250, as shown in FIG. 7.

The socket 130, the saddle 135, and the adjustable surfaces 140 can eachbe independently adjusted to provide proper alignment with the processchamber/bowl 400. Adjustment is provided by turning one or more of thejack screws.

By attaching the lift and rotate assembly 200 to the exposed surface 125of processing tool 100 via the pins 250 and corresponding hardware 130,135 and 140, the lift and rotate assembly 200 can be readily attachedand detached from the processing tool 100. Furthermore, the full surfaceof the deck 110 can then be used to provide an opening for theprocessing chamber/bowl 400 thereby maximizing bowl size.

Another factor which influences the available space on the deck 110 isthe depth D of the base 210. The depth of the base 210 is affected bythe arrangement of the mechanical and electrical components inside thebase 210.

FIGS. 9 and 10 illustrate the lift and rotate assembly of FIGS. 4 and 6with the back covers removed. With the back covers removed, the internalstructure of the base 210 of the lift and rotate assembly 200 becomesvisible.

The preferred embodiment of the lift and rotate assembly 200 includes alift mechanism 255. The lift mechanism includes a lift axis motor 260and a lift actuator 265, which turns a ball screw 270. As the ball screwturns, a guide block 275 travels up and down the ball screw. The guideblock 275 is coupled to the second portion 220 of the body 210.Correspondingly, as the guide block 275 travels up and down in responseto the turning of the ball screw 270, the second portion 220 of the base210 is raised and lowered.

A compressed gas spring 280 is coupled between the first portion 215 andthe second portion 220 of the base 210. The gas spring 280 ideallyprovides a counterbalance force approximately equivalent to the force ofgravity being exerted on the process head 205 and related componentsbeing similarly raised and lowered. This minimizes the force required bythe lift axis motor 260 for raising and lowering the process head 205.

The preferred embodiment further includes a linear encoder 282, whichprovides the lift mechanism 255 with absolute coordinates for locatingitself.

Located within the second portion 220 of the base 210 is a rotate axisassembly 285. The rotate axis assembly includes a sensor 290 and asensor flag 295 for monitoring the rotational movement of the processhead 205. The rotate axis assembly is coupled to a rotating mechanism300 (FIG. 11) including a motor 305 (FIG. 11) located in the processhead 205.

The shaft 310 of the motor 305 is coupled to and rotationally fixed withrespect to the base 210. By fixing the motor shaft 310, the motor 305rotates when activated, correspondingly rotating the process head 205.This enables the processing head to be rotated, and the bulk of themotor 305 to be located in the processing head 205. As a result, a base210 having a reduced depth D is possible.

The process head 205 receives at least one of signals, gases, and fluidsfrom the signals, gases, and fluids supplied to the lift and rotateassembly 200 via the connection box 230 and a cable assembly 295. Thecable assembly includes a cable loop 315 for feeding additional lengthof cable to account for movement by the lift mechanism 255 and therotating mechanism 300. In positioning the rotating mechanism 300 andthe lift mechanism 255, the rotating mechanism 300 has been aligned withthe lift mechanism 255 so as to provide a common direction of movement.

By providing a common direction of movement a single cable loop 315 canprovide additional cable length for both the lift direction of movementand the rotational direction of movement, thus eliminating the need fora second cable loop. By eliminating the need for a second cable loopfurther space is conserved within the base 210 of the lift and rotateassembly 200.

The base 210 further includes circuitry 320 for controlling thefunctioning of the lift and rotate assembly 200.

By locating the bulk of the rotating mechanism 300 in the process head205 and eliminating the need for a second cable loop, space is conservedin the base 210 of the lift and rotate assembly 200. Correspondinglythis allows for the depth D of the lift and rotate assembly 200 to bereduced and greater space on the deck 110 of the processing tool 100 tobe available for the processing chamber/bowl 400.

FIG. 11 illustrates a side cross sectional view of the lift and rotateassembly rotated down in the processing position. In addition toillustrating the presence of the bulk of the motor for the rotatingmechanism 300 in the processing head, FIG. 11 illustrates a second motor325 adapted for spinning a received workpiece in a plane parallel to theface 330 of the process head 205.

Numerous modifications may be made to the foregoing system withoutdeparting from the basic teachings thereof. Although the presentinvention has been described in substantial detail with reference to oneor more specific embodiments, those of skill in the art will recognizethat changes may be made thereto without departing from the scope andspirit of the invention as set forth in the appended claims.

What is claimed is:
 1. A workpiece processing tool frame adapted forreceiving one or more workpiece processing stations, comprising: anexposed surface against which at least a portion of a workpieceprocessing station is received, said surface comprising a socket adaptedfor receiving a first pin of a workpiece processing station, and asaddle adapted for receiving a second pin of the workpiece processingstation.
 2. The tool frame of claim 1, wherein said socket includes aspherical recess adapted for receiving the first pin.
 3. The tool frameof claim 1, wherein said socket includes an adjustment mechanism foradjusting the position of said socket with respect to said exposedsurface.
 4. The tool frame of claim 3, wherein said adjustment mechanismincludes a jack screw.
 5. The tool frame of claim 1, wherein said saddleincludes a cylindrical recess adapted for receiving the second pin. 6.The tool frame of claim 1, wherein said saddle includes an adjustmentmechanism for adjusting the position of said saddle with respect to saidexposed surface.
 7. The tool frame of claim 6, wherein said adjustmentmechanism includes a jack screw.
 8. The tool frame of claim 1, whereinsaid exposed surface further comprises a first adjustable surfaceagainst which a third pin of the workpiece processing station is adaptedto be received.
 9. The tool frame of claim 8, wherein said exposedsurface further comprises a second adjustable surface against which afourth pin of the workpiece processing station is adapted to bereceived.